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The highest class manufacturing clean room (Class 1 final clean).
Swansea HQ.
Prescott

Swansea, South Wales, UK
Our manufacturing and reclaim facility is situated in a new technology park in Swansea, Wales and is the most advanced plant of its kind in Europe. The initial size of the facility is in excess of 4,500 sqm total area. This includes over 2,000 sqm of production cleanrooms.

Prescott, Arizona, US
Our purpose built manufacturing and reclaim facility was constructed in 1998 with a total area in excess of 3,400 sqm. This includes over 1,500 sqm of production and cleanroom space.


Production space is divided into 3 clean room classifications. Class 10K for incoming inspection and strip & etch, Class 1K for polishing and better than class 1 for the final clean and packing. All facilities are designed for handling wafers under the same disciplines as for a sub micron IC manufacturing facility.

Our engineering systems are also compatible with sub micron manufacturing. A 40 cubic meter per hour 18 megohm system supplies the ultra pure DI water. Automated Chemical, slurry dispense and segregated systems help to provide a safe and environmentally friendly facility.

Pure Wafer is working to a demanding road map for process capability which will deliver close to prime test wafer quality. Our technical road map is a critical driver for our business and has been assembled through a detailed knowledge of our customer's road maps complemented by SEMI's road maps for Prime Silicon.

Technology is always advancing rapidly, so requirements for the new 0.05-micron node have to be in place now. Key to this is low metals (1 E10 and lower), wafer flatness (GBIR < 2 micron, SFQR maximum < 0.15 micron) and particles and LLS specified at 0.05/0.9 and 0.16 micron.