Metals

Film
Electroplated Cu (Ecu)
Technology
Electrochemical Deposition (ECD)
Tool
Sabre Extreme
Solutions
Interconnect, Advanced Memory

Copper deposition lays down the electrical wiring for the most advanced semiconductor devices. Even the smallest defect – say a microscopic pinhole or dust particle – in these conductive structures can impact device performance, from loss of speed to complete failure.

Ecu Capabilities
  • Electroplated Cu

    5,000 +/-5% to 100,000 +/-5% Å


Film
CVD Tungsten
Technology
Chemical Vapor Deposition (CVD)
Tool
Altus DirectFill
Solutions
Transistor, Interconnect, Advanced Memory, Packaging

Tungsten deposition is used to form conductive features like contacts, vias, and plugs on a chip. These features are small, often narrow, and use only a small amount of metal, so minimizing resistance and achieving complete fill can be difficult. At these nanoscale dimensions, even slight imperfections can impact device performance or cause a chip to fail.

CVD Capabilities
  • CVD Tungsten

    2,000 +/-5% to 7,000 +/-5% Å

  • CVD Tungsten Nitride

    55 +/-5% to 500 +/-5% Å


Film
Physical Vapor Deposition (PVD)
Technology
Sputter films
Tool
INOVA NExT
Solutions
Transistor, Interconnect, Advanced Memory, Packaging
PVD Capabilities
  • Ta

    50 +/-5% to 2,000 +/-5% Å

  • TaN

    50 +/-5% to 2,000 +/-5% Å

  • Ti

    50 +/-5% to 1,000 +/-5% Å

  • TiN

    50 +/-5% to 2,000 +/-5% Å

  • Al

    200 +/-5% to 20,000 +/-5% Å

  • Cu

    100 +/-5% to 2,000 +/-5% Å

  • Co

    100 +/-5% to 2,000 +/-5% Å

  • W

    100 +/-5% to 2,000 +/-5% Å

Other films offered by our strategic partners

BLANKET FILMS 8”
  • Dielectric Films: LPCVD TEOS, LPCVD Nitride, BPSG, HDP, Al2O3 (ALD), HfO2 (ALD)
  • PVD Films: Ni, Cu, Al, TiN, Sn, Ti, Cr, ITO, TiW, Ta, Au, GST, Mo, Co, AIN, Ru, IMP Ti, PVD TiN, Cu/Mn Alloy
  • E Beam Evaporator Films: Ni, Cu, Al, Pt, Sn, Ti, Cr, Ag, Au
  • MEMS insulator Films: Al2O3, TiO2, Poly, Low stress nitride
  • MEMS Electroplating Films: Au, Ni, NiCo
  • Other Conductor Films: Doped Poly, MOCVD TiN, Co, esc Al, CVD W
BLANKET FILMS 12”
  • Thin Films: HARP, Black Diamond (k=2.4~2.9), BPSG, Thermal Oxide, Polysilicon, LPCVD Nitride
  • Metals: HARP, Black Diamond (k=2.4~2.9), BPSG, Thermal Oxide, Polysilicon, LPCVD Nitride
  • Organic:Blanket Photoresist Coating (ArF), Polymide, SOC
PATTERN WAFER PRODUCTS 8”
  • MIT 854 Cu/TEOS
  • MIT 854 Cu/BD1
PATTERN WAFER PRODUCTS 12”
  • PATTERN WAFER PRODUCTS 12”