Capabilities

  • Wafer Size

    50.8mm - 300mm

  • Metals

    < 1E10 / CM2

  • TTV

    < 1um

  • LPD

    > 32nm

  • Processes

    Strip & Etch, Lapping, Laser Scribe, Polish, Clean

  • Capacity

    100,000 wafers / month

  • Removable Films

    Cu, Ti, Fe, V, TiN, Cr, Al, Ta, SiO, Ti, Zr 100% inspection