The strip and etch process includes a solution, a mixture of solutions, or a mixture of gases that attacks the surfaces of a film or wafer substrate, removing material either selectively or non-selectively.
The etch process has three main purposes:
- Removing thin metal films deposited on silicon wafers
- Remove contaminants and particulates after grinding or lapping processes
- Reduce stress after grinding or lapping processes
Removable films include but are not limited to
Cu, Ti, Fe, V, TiN, Cr, Al, Ta, SiO, Ti, Zr