Polish

Pure Wafer provides polishing services designed to reduce surface roughness and obtain a mirror-like finish on wafer substrates. Polishing is a Thermal-Chemical-Mechanical process which under the prospered balance, produces a surface free of damage, scratches and stains.

In addition to standard polishing procedures, Pure Wafer also provides a kiss-polishing service, which involves a light and delicate polish to remove minor surface scratches or defects.

Pure Wafer possesses single side and double side polishing process capability. Double side polishing produces wafers with the lowest TTV values in the industry.

Class 1000 Polishing Area
Class 1000 Polishing Area
Double Side Polishers
Double Side Polishers
Capabilities

  • Surface Roughness

    < 5E

  • TTV

    < 5µm

  • Minimum Polishing Range

    225 - 250µm

  • Maximum Polishing Range

    1500µm

Cleaning

Pure Wafer cleaning capabilities include standard RCA cleaning with megasonics for 300mm plus double side scrubbing for 100mm, 150mm and 200mm wafers. Surface metal content is monitored by measuring wafers in an ICPMS lab.

Class 1 Cleanroom
Class 1 Cleanroom
Capabilities

  • Sample Size

    10+ elements checked per customer

  • 300mm process capability

    at 90nm / 65nm / 50nm / 34nm

  • Particle Detection Method

    KLA Tencor SP2 xp

  • Metals Detection Limit

    1e8 atoms/cm2

  • Metals Detection Method

    VPD ICPMS

  • LPD

    Down to 32nm level

  • Metals Detection Limit

    1e8 atoms/cm2

  • Maximum Polishing Range

    1500µm

Grinding

Grinding provides a unique ground surface finish which can greatly increase the quality of the flatness of the substrate. Grinding allows Pure Wafer to deal with and remove films that are difficult to remove chemically, as well as to grind wafers down to 50µm.

Capabilities

  • Diameter

    100 - 300mm

  • TTV

    As low as 2µm (before polishing)

  • Thickness

    Can grind wafers as thin as 50µm